TWHM-ISA98

<body bgcolor=lightyellow> <img src=logo.gif align=left> <center> <font size=+2> 1998 Topical Workshop on Heterostructure Microelectronics<Br> for Information Systems Applications </font> <br> <font size=+1> <a target=_top href=http://www.shonan-inet.or.jp/~svc/>Shonan Village Center</a><br> Hayama-Machi, Kanagawa, Japan<br> August 30 to September 2, 1998 </font> </center> <br clear=left> <p> <head> <base target=_top> <body bgcolor=lightyellow> The 1998 Topical Workshop on Heterostructure Microeletronics (TWHM'98) will be held at the <a href=http://www.shonan-inet.or.jp/~svc/> Shonan Village Center</a>, Hayama-Machi, Kanagawa, Japan from the August 30th to the September 2nd, 1998. Following the tradition established by the <a href=http://www.nmjc.org/aoard/TWHM96.html> previous Topical Workshops on Heterostructure Microelectronics held near Mt.Fuji and in Sapporo, Japan</a>, TWHM'98 will bring together an international group of engineers and scientists in the emerging field of heterostructure microelectronics which has broad applications in the areas of wireless systems, global grid, communications, as well as signal and data processing. TWHM'98 will complement the <a href=http://ssdm.bcasj.or.jp/>1998 International Conference on Solid State Devices and Materials</a> (SSDM), which will be held in Japan from September 7th to 10th, 1998, by allowing detailed deliberations focused on applications of heterostructure microelectronics. In keeping with the informal character of workshop, TWHM'98 is scheduled in a way that there will be no parallel sessions. <p> The objective of the 1998 Topical Workshop on Heterostructure Microeletronics is to address critical technical issues in the development and application of heterostructure microelectronics technologies by providing a forum for international collaboration. This year's workshop will focus on HBT and HEMT technologies based upon a range of heterostructure material systems including III-Vs (e.g. GaAs, InP, etc.) group IV (e.g. SiGe), and wide bandgap semiconductors (e.g. GaN and SiC). Papers are solicited in areas of heterostructure materials and device development, circuit demonstration, as well the application of heterostructure microelectronic technologies to wireless, telecommunications, and signal/data processing systems. <p> To obtain further information, to add your name to the mailing list or to submit an abstract, please contact the TWHM-ISA '98 Conference Secretary. <b>Abstracts should be two pages long describing original results in the above areas and should be submitted by April 3rd, 1998. </b> Due to the limited size of the workshop, pre-registration is strongly encouraged. <p> <head> <base target=_top> <body bgcolor=lightyellow> <table width=100%> <tr valign=top> <td width=50%> <b><u>Workshop Co-Chairs</u></b> <p> <font size=-1> <a href=/dp-group/biographies/pavlidis.html>Professor Dimitris Pavlidis</a>, <a href=http://www.umich.edu/>The University of Michigan</a> <p> <a href=ishibashi.html target=info>Dr. Tadoo Ishibashi</a>, <a href=http://www.ntt.co.jp/>NTT System Electronics Laboratories</a><p> </font> <P> <b><u>Organizing and Technical Programing Committee</u></b> <p> <b>Technical Co-Chairs</b> <font size=-1> <p> Dr. Burhan Bayraktaroglu, <a href=http://www.northgrum.com/>Northrop Grumman</a> <br> Prof. Takashi Mizutani, <A href=http://www.nagoya-u.ac.jp/>Nagoya University</a> <p> </font> <p> <b>Secretary</b> <font size=-1> <p> <a href=nguyen.html target=info>Chanh Nguyen</a>, <a href=http://www.hrl.com/>Hughes Research Laboratories</a> <p> </font> <b>Financial Administrator:</b> <font size=-1> <p> <a href=http://www.pe.titech.ac.jp/~miya/Welcome-e.html> Prof. Yasuyuki Miyamoto</a>, <a href=http://www.pe.titech.ac.jp/>Tokyo Inst. of Technology</a> <p> </font> <b>Sponsor Coordination</b> <font size=-1> <P> Dr. Shiro Fujishiro, <a href=http://www.afosr.af.mil/>AFOSR/AOARD</a><br> Dr. Koto White, <A href=http://www.afosr.af.mil/>AFOSR/AOARD</a> </font> </td><td> <b>Committee members:</b> <font size=-1> <p> Dr. Don Davanzo, <a href=http://www.hp.com/>Hewlett Packard</a><br> Dr. Takatomo Enoki, <a href=http://www.ntt.co.jp/>NTT</a><br> Prof. Hideki Hasegawa, <A href=http://www.hokudai.ac.jp/index-e.html>Hokkaido University</a><br> Prof. Kazuhiko Hirakawa, <a href=http://www.u-tokyo.ac.jp/>University of Tokyo</a><br>  Dr. U. König, <A href=http://www.daimlerbenz.com/>Daimler-Benz</a>, Germany<br> Dr. Kazuhiko Matsumoto, ETL<br> Dr. Shigeharu Matsusita, <a href=http://www.sanyo.co.jp/index_e.html>Sanyo Electric</a><br> Prof. Umesh Mishra, <a href=http://www.ucsb.edu/>UCSB</a><br> Dr. Yasuo Mitsui, <a href=http://www.mitsubishi.co.jp/index_E.html>Mitsubishi</a><br> Prof. Koji Mizuno, <a href=http://www.tohoku.ac.jp/>Tohoku University</a><br> Dr. Kohei Morizuka, <a href=http://www.toshiba.co.jp/>Toshiba</a><br> Dr. Tohru Nakamura, <a href=http://www.hitachi.co.jp/>Hitachi</a><br> Dr. Seiji Nishi, <a href=http://www.oki.co.jp/>Oki Electric</a><br> Dr. Fritz Schuermeyer, <a href=http://www.afrl.af.mil/>Wright Patterson Air Force Laboratory</a><br>  Prof. Saburo Takamiya, <a href=http://www.kanazawa-u.ac.jp/>Kanazawa University</a><br> Dr. Hirokuni Tokuda, <A href=http://www.toshiba.co.jp/>Toshiba</a><br> Dr. Daisuke Ueda, <a href=http://www.mei.co.jp/>Matsushita</a><br> Dr. Naoki Yokoyama, <a href=http://www.fujitsu.co.jp/index-e.html>Fujitsu</a><br> Dr. John Zolper, <a href=http://www.onr.navy.mil/>ONR</a> <p> </font> </td> </tr> </table> <p> <head> <base target=_top> </head> <body bgcolor=lightyellow> <b><u>Preliminary Invited Speaker Topics</u></b> <ul> <li>Microwave Components for Mobile Communications <li>HBT Analog and High-Speed Applications <li>HEMT Analog Applications <li>Compound Semiconductors for Instrumentation <li>Satelite Appplication of Heterostructure Devices <li>Wafer-Bonding Techniques of III-Vs to Si and Applications to Electronic/Optical Devices <li>Transfer Substrate Technology for High-Frequency HEMTs and HBTs <li>Nitride FETs <li>Nitride Optoelectronics <li>High-Performance Si/SiGe HBTs <li>Resonant Tunneling Devices and Circuit Applications <li>Commercial Application of Heterostructure Devices </ul> <p> <head> <base target=_top> <body bgcolor=lightyellow> <table width=100%> <tr valign=top> <td width=33%> <b><u>US Workshop Chair</u></b> <font size=-1> <p> <b>Prof. Dimitris Pavlidis</b><br> The University of Michigan<br> <a href=http://www.eecs.umich.edu/>Department of Electrical Engineering and <br> Computer Science</a><br> 2307 EECS Building<br> 1301 Beal Avenue<br> Ann Arbor, MI 48109-2122<br> Tel.: (313) 647-1778<br> Fax.: (313) 763-9324<br> email: <a href=mailto:pavlidis@umich.edu>pavlidis@umich.edu</a><br> URL: <a href=http://www.eecs.umich.edu/dp-group/>www.eecs.umich.edu/dp-group/</a> <p> </font> <b><u>US Technical Program Committee:</u></b> <font size=-1> <p> <b>Dr. Burhan Bayraktaroglu, Chair</b><br> <a href=http://www.northgrum.com/>Northrop Grumman Corporation</a><br> Electronics Senors and Systems Division<br> P.O. Box 1521, MS 3K13<br> Baltimore, MD 21203<br> Tel: 410-765-2947, Fax: 410 765-7370<br> e-mail: <a href=mailto:burhan.b@postal.essd.northgrum.com> burhan.b@postal.essd.northgrum.com</a> <p> </td><td witdth=33%> <font size=-1> <b>Don Davanzo</b><br> <a href=http://www.hp.com/>Hewlett Packard</a><br> 1400 Fountain Grove Parkway<br> Santa Rosa, CA. 95404<br> Tel: 707 577-1400 Ext. 2644, Fax: 707 577-2036<br> e-mail: <a href=mailto:doncd@lion.sr.hp.com>doncd@lion.sr.hp.com</a> <p> <b>Dr. U. König</b><br> <a href=http://www.daimlerbenz.com/>Daimler-Benz AG</a><br> Forschungszentrum<br> F2H<br> Wilhelm-Runge-Str. 11<br> 89081 Ulm, Germany<br> Tel: 49 731 505-2050, Fax: 49 731 505-4102 <p> <B>Dr. Chanh Nguyen, Secretary</b><br> <a href=http://www.hrl.com/>Hughes Research Laboratories</a><br> MS RL61<br> 3011 Malibu Canyon Rd.<br> Malibu, CA 90265<br> Phone: 310-317-5605, Fax: 310-317-5450<br> e-mail: <a href=mailto:cnnguyen@hrl.com>cnnguyen@hrl.com</a> <p> </td><td witdth=33%> <font size=-1> <b>Professor Umesh Mishra</b><br> <a href=http://www.ece.ucsb.edu/> Dept. of Elec. & Engin. and Computer Science</a><br> University of California<br> Santa Barbara, CA 93106-9560<br> Tel: 805 893-3586, Fax: 805 893-3262<br> e-mail: <a href=mailto:mishra@xanadu.ece.ucsb.edu> mishra@xanadu.ece.ucsb.edu</a> <p> <b>Dr. Fritz Schuermeyer</b><br> <a href=http://www.afrl.af.mil/> Wright Laboratory</a><br> WL/AADD<br> Wright-Patterson AFB, OH 45433-6543<br> Tel: 513 255-8649, 513-255-1874, <br> Fax: 513 255-2306<br> e-mail: <a href=mailto:fritz@el.wpafb.af.mil>fritz@el.wpafb.af.mil</a> <p> <b>Dr. John Zolper</b><br> Electronics Division, Code-312<br> <a href=http://www.onr.navy.mil/>Office of Naval Research</a><br> 800 North Quincy Street<br> Arlington, VA 22217-5660<br> PH: 703-696-1437<br> Fax: 703-696-2611<br> email: <a href=mailto:zolperj@onr.navy.mil> zolperj@onr.navy.mil</a> </font> </td> </tr> </table> <p> <HTML> <HEAD> <TITLE>REGISTRATION and ACCOMMODATIONS</TITLE> </HEAD> <BODY bgcolor=lightyellow> <H2 ALIGN=CENTER>REGISTRATION and ACCOMMODATIONS</H2> <P><B>Shonan Village Center</B> is designed for seminars and small workshops. Restaurants and accommodations are served by reservation only, basically. Staying at S<B>honan Village Center</B> as accommodation is strongly recommended. For more information, you can see the home page of the center to <A HREF="http://www.shonan-inet.or.jp/~svc/">http://www.shonan-inet.or.jp/~svc/</A> </P> <P>The registration fee is ¥30,000 by July 30, 1998 and ¥35,000 after July 31, 1998. The registration fee includes conference facilities, coffee breaks, lunches during conference, the excursion, the reception on Aug.30 and the dinner cruise on Sept.1st. The registration fee for accompanying person is ¥7,000. The fee includes lunch on Sept.1st, the excursion, the reception and the dinner cruise.</P> <P>The accommodation fee for a participant (in a single room) is ¥40,000.This fee includes breakfasts during the Workshop and dinner on Aug.31. If you share a twin room with another participant, the accommodation fee is reduced to ¥35,000. Please suggest the name of another participant on the accommodation form, if any. A participant sharing a twin room with a non-participating partner should pay ¥70,000 in total. The accommodation form must be received by July 30, 1998.</P> <P>For registration and accommodations, please fill out <A target=_top HREF="regist.htm">TWHM-ISA'98 REGISTRATION and ACCOMMODATION FORM</A> and return by fax or mail to </P> <CENTER><P><FONT SIZE=-1>Financial Administrator TWHM-ISA '98 <BR> Prof. Yasuyuki Miyamoto, <BR> Dept. of E&EE, Tokyo Inst. of Tech. <BR> 2-12-1 O-okayama, Meguro-ku <BR> Tokyo 152-8552 JAPAN <BR> Fax:+81-3-5734-2907 <BR> Tel. +81-3-5734-2572 <BR> E-mail: <A HREF="mailto:miya@pe.titech.ac.jp">miya@pe.titech.ac.jp</A> </FONT></P></CENTER> <P>If you need special arrangements such as partial attendance due to unavoidable circumstances etc., more than one accompanying person, or accommodation before and after the workshop at Shonan Village Center, please contact the Workshop Financial Administrator as above.</P> <H2 ALIGN=CENTER>SOCIAL EVENTS</H2> <P>A <B>Welcome Reception</B> will be held on August 30, <B>Sunday</B>, in the evening. An <B>Excursion</B> is planned on September 1st, <B>Tuesday</B>, in the afternoon followed by a <B>Workshop dinner</B> in the evening on Sagaminada Bay Cruise.</P> </BODY> </HTML> <p> <HTML> <HEAD> <TITLE>TWHM-ISA'98 REGISTRATION and ACCOMMODATION FORM</TITLE> </HEAD> <BODY bgcolor=lightyellow> <H2 ALIGN=CENTER>TWHM-ISA'98 REGISTRATION and ACCOMMODATION FORM</H2> <CENTER><TABLE WIDTH="100%" > <TR> <TD VALIGN=CENTER>Family name:</TD> <TD>First name:</TD> <TD>Middle Initial:</TD> </TR> <TR> <TD COLSPAN="3">Affiliation:</TD> </TR> <TR> <TD COLSPAN="3">Address:</TD> </TR> <TR> <TD>City:</TD> <TD>Post Code: </TD> <TD>Country:</TD> </TR> <TR> <TD>Phone:</TD> <TD>Fax: </TD> <TD>E-mail:</TD> </TR> </TABLE></CENTER> <CENTER><TABLE WIDTH="100%" > <TR> <TD><B>Registration </B> <DIV ALIGN=right><P>(Including lunches during conference, reception on 8/30, Excursion and Dinner cruise on 9/1)</P></DIV> </TD> <TD></TD> </TR> <TR> <TD> <DIV ALIGN=right><P>(by July 30 '98)<BR> (After July 31 '98)</P></DIV> </TD> <TD> <UL> <P><IMG SRC="box.gif" ALT="[ ]" HEIGHT=24 WIDTH=22 ALIGN=ABSCENTER>¥30,000 <BR> <IMG SRC="box.gif" ALT="[ ]" HEIGHT=24 WIDTH=22 ALIGN=ABSCENTER>¥35,000 </P> </UL> </TD> </TR> <TR> <TD><B>Acocomanying person </B> <DIV ALIGN=right><P>(Including lunch on 9/1, Excursion,Reception and Dinner cruise for non-participant partner) </P></DIV> </TD> <TD> <UL> <P><IMG SRC="box.gif" ALT="[ ]" HEIGHT=24 WIDTH=22 ALIGN=ABSCENTER>¥7,000 </P> </UL> </TD> </TR> <TR> <TD><B>Accommodation </B> <DIV ALIGN=right><P>(by July 30, '98) (Including breakfasts during conference and dinner on 8/31) </P></DIV> </TD> <TD></TD> </TR> <TR> <TD> <DIV ALIGN=right><P>participant (single room)<BR> participant sharing twin room with another participant<BR> <BR> <BR> participant sharing twin room with non participating partner</P></DIV> </TD> <TD> <UL> <P><IMG SRC="box.gif" ALT="[ ]" HEIGHT=24 WIDTH=22 ALIGN=ABSCENTER>¥40,000<BR> <IMG SRC="box.gif" ALT="[ ]" HEIGHT=24 WIDTH=22 ALIGN=ABSCENTER>¥35,000 - per person <BR> (Please suggest name of another participant, if any): <BR> <BR> <IMG SRC="box.gif" ALT="[ ]" HEIGHT=24 WIDTH=22 ALIGN=ABSCENTER>¥70,000 - total </P> </UL> </TD> </TR> <TR> <TD> <DIV ALIGN=right><P>Total</P></DIV> </TD> <TD> <UL> <P>¥</P> </UL> </TD> </TR> </TABLE></CENTER> <P><B>Methods of payment: </B></P> <P><IMG SRC="box.gif" ALT="[ ]" HEIGHT=24 WIDTH=22 ALIGN=ABSCENTER>Bank transfer to The Bank of Yokohama Ltd. Atsugi Branch Account no.:451-1742681, Account name:TWHM-ISA '98 Please send copy of the bank transfer receipt with this form.</P> <P><IMG SRC="box.gif" ALT="[ ]" HEIGHT=24 WIDTH=22 ALIGN=ABSCENTER>Please charge my credit card Credit card number: </P> <UL> <P>Company: <IMG SRC="box.gif" ALT="[ ]" HEIGHT=24 WIDTH=22 ALIGN=ABSCENTER>VISA <IMG SRC="box.gif" ALT="[ ]" HEIGHT=24 WIDTH=22 ALIGN=ABSCENTER>MASTER <IMG SRC="box.gif" ALT="[ ]" HEIGHT=24 WIDTH=22 ALIGN=ABSCENTER>AMEX</P> </UL> <UL> <CENTER><TABLE WIDTH="100%" > <TR> <TD>Exp. Date:</TD> <TD>Signature: </TD> <TD>Date: </TD> </TR> </TABLE></CENTER> <CENTER><P><FONT SIZE=-1>Please fax or mail to Financial Administrator TWHM-ISA '98 <BR> Prof. Yasuyuki Miyamoto, <BR> Dept. of E&EE, Tokyo Inst. of Tech. <BR> 2-12-1 O-okayama, Meguro-ku <BR> Tokyo 152-8552 JAPAN <BR> Fax:+81-3-5734-2907 <BR> Tel. +81-3-5734-2572 <BR> E-mail: <A HREF="mailto:miya@pe.titech.ac.jp">miya@pe.titech.ac.jp</A></FONT></P></CENTER> </UL> </BODY> </HTML> <p> <body bgcolor=white> <center><font size=-1>Design by <a target=_top href=/dp-group/>III-V Integrated Devices and Circuits Group</a></font></center>