Field-Effect-Transistors and Microwave
Monolithic Integrated Circuits Technology
Physical and electrical properties of III-V materials, epitaxy and
ion-implantation, GaAs and InP based devices (MESFETs, HEMTs varactors) and
Microwave Monolithic Integrated Circuits (MMICs). Cleaning, Photolithography,
metal and dielectric deposition, wet and dry etching. Device isolation, ohmic
and Schottky contacts, dielectrics, passive component technology, interconnects,
via holes, dicing and mounting. Study of the above processes by DC
characterization. dipoles, loops and traveling-wave antennas. Analysis and
synthesis of linear arrays. Phased arrays. Input impedance and method of
moments. Mutual impedance. Aperture antennas: slot, Babinet’s principle.
Microstrip antennas. Horns, refl ector and lens antennas.
Prerequisite: Graduate Standing and
EECS 421, and either EECS 525 or EECS 528. II even years (3 credits)