FACILITIES OF THE SSEL



Within the Solid-State Electronics laboratory, complete facilities exist for solid- state device and circuit fabrication. These facilities include equipment for mask making, photolithography, oxidation and diffusion, dry pattern transfer (plasma, RIE), ion-beam deposition and milling, vacuum evaporation and sputtering, chemical vapor depositon, and molecular-beam epitaxy. Facilitiesfor the characterization of III-V semiconducting materials are available as well as facilities for high-performance silicon-gate NMOS circuits and for the realization of submicron-gate HEMT and MESFET structures, which are being optimized and applied in microwave and high-speed logic circuiits. Instrumentation exists in the Laboratory for device characterization to 350 GHz.

The Laboratory moved into a new Solid-State Fabrication Facility in the EECS Building on the North Campus in September 1986. This state-of-the-art process facility has been designed as a center of excellence in the solid-state device area, with major thrusts planned in the areas of high-speed devices and device technology, high-performance solid-state sensors, optoelectronics, and automated semiconductor manufacturing. The Facility offers a full range of process tools, including electron-beam lithography, MBE, MOMBE, MOCVD, ion implantation, and LPCVD. This capability is centered in 4,000 square feet of class-100 processing area, with approximately 1000 square feet of class-10 space devoted to submicron lithography. This Facility is intended as a catalyst for high technology in the midwest and represents a major commitment by the University and the State of Michigan to excellence in the above areas. The Facility includes:

  1. Processing Line for Indium Phosphide and Gallium Arsenide Devices and Circuits.
  2. Submicron Facility for Direct Wafer Writing and Mask Fabrication
  3. Film Deposition Line.
  4. Plasma Process Line.
  5. Material Growth Line.
  6. Processing Line for Silicon Circuits and Sensors.
  7. Testbed for Automated Semiconductor Processing.
  8. Separate Instruction Facility.

  • SSEL Entry in the University Facility Index


    Review of Group Activities

    III-V Integrated Devices and Circuits Group

    [GaN] [InP] [GaAs] [MOCVD] [Mixer] [Gunn (NDR)] [PIN] [HBTs] [HEMTs] [MMICs]

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