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Defense Event

Low Temperature Wafer Level Vacuum Packaging Using Au-Si Eutectic Bonding and Localized Heating

Jay Mitchell


Mechanical Engineering
 
Friday, December 07, 2007
2:30pm - 4:30pm
1005 EECS

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Additional Information

Contact: Beth Stalnaker

Email: beths

Sponsor(s): Khalil Najafi

Open to: Public