Part: 50GSG100
Deposit Date: 04.18.03
Process Technology: TSMC 0.18
Type: Hard
Design: Full-Custom
Designer: Michael S. McCorquodale
Affiliation: University of Michigan
Qualification: Post-Silicon Verified
Instantiated: Yes
Patent: None
Description: 50x50 micron ground-signal-ground (GSG) bonding pad with 100 micron pitch. This macro has been developed per Cascade Microtech's ACP GSG100 RF probe bondpad specification. The pad is passive and contains no ESD or other active devices.

Part: PAD50
Deposit Date: 04.18.03
Process Technology: TSMC 0.18
Type: Hard
Design: Full-Custom
Designer: Michael S. McCorquodale
Affiliation: University of Michigan
Qualification: Post-Silicon Verified
Instantiated: Yes
Patent: None
Description: 50x50 micron bonding pad. The pad is passive and contains no ESD or other active devices.