Part: CHAR
Deposit Date: 07.23.03
Process Technology: Not process dependent
Type: Hard
Design: Full-Custom
Designer: Michael S. McCorquodale
Affiliation: University of Michigan
Qualification: Post-Silicon Verified
Instantiated: Yes
Patent: None
Description: A list of characters (A to Z and 0 to 9) that are 10 Micron tall. To be used in labelling bond pads.

Part: METAL_FILL
Deposit Date: 01.05.04
Process Technology: TSMC 0.18
Type: Hard
Design: Full-Custom
Designer: Eric D. Marsman
Affiliation: University of Michigan
Qualification: Post-Silicon Verified
Instantiated: Yes
Patent: None
Description: A large and small metal fill cell for increasing metal density for CMP DRC rules . These cells short the node to the substrate and are built to be put into arrays. Designed for TSMC18 process with Thick Top Metal (TTM) option.