Electrical Engineering and Computer Science

ECE News Story

ECE Startup ePack, Inc. Wins Masco Next Gen Manufacturing Award at Innovation Competition

ePack, Inc. received the award and $25K at the second annual Accelerate Michigan Innovation Competition, held Nov. 15-17, 2011. The company specializes in advanced packaging solutions for MEMS devices, especially electronic sensors. MEMStim earned an honorable mention in the student category. [Full Story]

Related Topics:  MEMS and Microsystems  Najafi, Khalil  Technology Transfer